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3D Online SPI HMS-5 HMS-5-D for Solder Paste Quality Monitoring - China Suppliers & Factory Solutions
Production Overview
It is used to detect and monitor the quality of solder paster printing. With the increasing precision of electronic products, chip components are becoming smaller and smaller, and the requirements for solder paster printing quality are gradually increasing. It can effectively guarantee the printing quality, improve the printing quality, reduce the defect rate of the product, save labor, and improve the production efficiency.
High speed can achieve maximum throughput
The all-digital high-speed CCD camera cooperates with the industrial telecentric lens, high resolution, ultra wide depth of field, ultra low distortion and unique parallel light design, etc. It can clearly image the circuit board and the tall components without strabismus.
Plate bending compensation solution
Real-time measurement and compensation of board bending (refer to ideal board), can reach less than 2mm; provide clear PCB images and measurement data online in real time.
3D raster projection head
Realize shadowless 3D detection without worrying about inaccurate measurement caused by shadows; five-step phase shift algorithm based on defocused sine grating stripes, height detection accuracy up to 1μm.
Man-machine interface with easy operation
Support Gerber, CAD import, support offline programming and manual programming, easy to operate, can switch between Chinese and English system; Through more intuitive software, display 2D/3D true color images to help users read bad; choose 2 commonly used Mark points.
High precision mechanical platform
With AC servo motor system, coupled with precision ball screws and linear guide pairs, ensures high-speed and accurate detection capabilities, fast and stable movement, and positioning accuracy of less than 10μm.
Supports Offline SPC
Display histogram/control chart and true-color three-dimensional stereoscopic image, and export reports and pictures at any time period to trace the root cause of badness from the detection results.
Frequently Asked Questions (FAQ)
What is the primary function of the 3D online SPI system?
The system is designed to detect and monitor the quality of solder paste printing. It guarantees printing quality, reduces product defect rates, saves labor, and improves production efficiency as chip components continue to shrink.
How does the system achieve high-speed and clear imaging?
It utilizes an all-digital high-speed CCD camera combined with an industrial telecentric lens. This setup features high resolution, ultra-wide depth of field, ultra-low distortion, and a unique parallel light design to image circuit boards and tall components clearly without strabismus.
What is the capability of the plate bending compensation solution?
It provides real-time measurement and compensation of board bending (relative to an ideal board) down to less than 2mm, providing clear PCB images and measurement data online in real time.
What accuracy does the 3D raster projection head offer?
It features a height detection accuracy of up to 1μm, utilizing a five-step phase shift algorithm based on defocused sine grating stripes to achieve shadowless 3D detection.
What programming and file formats are supported by the interface?
The easy-to-operate man-machine interface supports Gerber and CAD import, as well as both offline and manual programming. It also supports switching between Chinese and English systems.
How does the system help trace the root causes of defects?
By supporting Offline SPC, the system can display histograms, control charts, and true-color 3D stereoscopic images. Users can export reports and pictures at any time to trace quality issues directly from detection results.