Automatic SMT Stencil Cleaning Machine BMP-1000X - Reliable China Suppliers and Factory Solution
1. Automatic and Efficient Cleaning Process
The BMP-1000X stencil cleaning machine features a fully automatic cleaning mode where the screen is thrown up and down while heated cleaning liquid is sprayed through spray arms at high pressure. This high-pressure spray is reciprocated for thorough cleaning. The entire process, including cleaning, rinsing, and drying, is automatic, making it highly efficient and user-friendly.
2. Innovative Design for Comprehensive Cleaning
The machine uses a scientific nozzle design (patent pending), with eight spray arms distributed on both sides to effectively cover blind spots and ensure complete cleaning. The nozzles and spray arms are detachable for easy maintenance. The nozzle pressure is adjustable, solving issues of collision and splashing, especially for smaller workpieces under high-pressure conditions. The visual window and LED light system enhance the visualization of the entire cleaning process, making it easy for operators to monitor.
3. Safety Features and Enhanced Cleaning Efficiency
The viewing window and the screen entrance are equipped with photoelectric sensors to prevent the cleaning liquid from spilling, ensuring safety during operation. The comprehensive cleaning system includes a diluent tank, rinsing tank, and a heating system that improves cleaning efficiency. This system shortens the cleaning time and is compatible with both running water washing and chemical cleaning, making it suitable for SMT applications.
4. Advanced Filtration and Cost-Effective Operation
The BMP-1000X is designed with an independent built-in filter system, including a dedicated electric pump, spray arm, and nozzle for washing and rinsing. This filtration system ensures the cleanliness of the rinse water and prevents solvent contamination, increasing the service life of the solvent and reducing overall usage. The machine’s durable construction, made of 304 stainless steel, resists corrosion from acidic and alkaline cleaning fluids. An emergency stop button and leakage protection further enhance safety.
5. Applications and Easy-to-Use Design
The BMP-1000X is a fourth-generation stencil cleaning machine specifically designed for water-based processes. It automatically completes cleaning, rinsing, and drying, using a unique double-eight spray arm design and double-four air knives for efficient drying. This machine is ideal for cleaning SMT stencils, copper meshes, glue meshes, glue printing jigs, and PCB misprints, effectively removing solder paste, red glue, and other contaminants from the surface after printing, including the hole wall.
Frequently Asked Questions (FAQ)
How does the automatic cleaning process of the BMP-1000X work?
The BMP-1000X operates in a fully automatic mode where the screen moves up and down while heated cleaning liquid is sprayed via reciprocating spray arms at high pressure. The entire process—including cleaning, rinsing, and drying—runs automatically.
How does the machine prevent blind spots during cleaning?
It features a scientific, patent-pending nozzle design with eight spray arms distributed on both sides. This setup ensures complete coverage, eliminates blind spots, and allows adjustable nozzle pressure to prevent collisions or splashing.
What safety features are included in the BMP-1000X?
The machine is equipped with photoelectric sensors on the viewing window and screen entrance to prevent liquid spillage. It also features leakage protection, an emergency stop button, and a durable 304 stainless steel body that resists corrosion.
How does the filtration system help reduce operational costs?
It utilizes an independent built-in filter system with a dedicated electric pump, spray arm, and nozzle. This prevents solvent contamination and keeps rinse water clean, which extends the service life of the solvent and lowers overall consumption.
What SMT parts and contaminants can this machine clean?
The BMP-1000X is ideal for cleaning SMT stencils, copper meshes, glue meshes, glue printing jigs, and PCB misprints. It effectively removes solder paste, red glue, and other surface contaminants, including those inside the hole walls.