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China Suppliers Factory JUKI JM-100 SMT Insertion Machine with Best Speed and Advanced Takumi Head Technology
Flexibility
Vision centering technology method can be selected based on component type, shape, size and material. Laser centering is used for high speed placement of smaller components. Vision is used when lead or ball inspection is needed or when the component is too large for the laser. Many nozzles are available for odd-shaped components providing unsurpassed component handling.
Automatic height change of recognition sensor
The 8-nozzle “Takumi head” automatically changes the laser sensor height according to the height of component that to be centered.
Various components from ultra-small component to large component can be optimally placed with best tact time.
LX-8, RS-1R: 6 levels (1, 3, 6, 12, 20, 25 mm) can be selected arbitrarily.
JM-100: 4 levels (16, 20, 25, 30 mm) can be selected arbitrarily.
Various components from ultra-small component to large component can be optimally placed with best tact time.
LX-8, RS-1R: 6 levels (1, 3, 6, 12, 20, 25 mm) can be selected arbitrarily.
JM-100: 4 levels (16, 20, 25, 30 mm) can be selected arbitrarily.
FLEXIBLE LINE SOLUTION
Provides optimal line solutions through versatility and productivity improvement.
DECAN Line
DECAN Line
- Optimal line configuration from chips to uniquely-shaped components according to options setup
- Standard equipment can be remodeled on site to equipment capable of large-scale PCB handling
- Responsive to a maximum 1,200 x 460mm PCB
- Responsive to uniquely-shaped components (including tray components)
Optimum line balance and highest throughput
Changing the RS-1 functionality does not require head replacement. The revolutionary design self-optimizes based on the production requirements. The RS-1R can reduce the workload on high speed. A line with two or more RS-1Rs can adjust to a wide variety of production requirements from high speed to high flexibility.
Active clinching
New active clinch unit supports bend in, bend out, and N bend to prevent components from lifting during reflow and make handling prior to reflow easier.
High-speed, on-the-fly centering
A high-resolution laser is mounted on the head to center components in all directions including angle. Centering is done on-the-fly, allowing high speed placement of components from small chips to SOPs.
Adaptable centering
1. Centering accommodates component variations
Laser centering measures the components on the side. It is not affected by variations of component color or width/length so, unlike vision centering, there is no need to edit component data for different component vendors.
Laser centering measures the components on the side. It is not affected by variations of component color or width/length so, unlike vision centering, there is no need to edit component data for different component vendors.
2. Component check function improves placement reliability
Since the laser is mounted on the head, it can be used to monitor the presence of components the entire time from pick to placement. This is difficult to accomplish with vacuum detection only. The placement reliability is also improved because the release of the component is confirmed after placement.
Since the laser is mounted on the head, it can be used to monitor the presence of components the entire time from pick to placement. This is difficult to accomplish with vacuum detection only. The placement reliability is also improved because the release of the component is confirmed after placement.
Frequently Asked Questions
Q1: How do I choose between laser centering and vision centering?
A1: You can select the method based on component type, shape, size, and material. Laser centering is ideal for high-speed placement of smaller components, whereas vision centering is preferred when lead or ball inspection is necessary, or when the component is too large for the laser.
Q2: How does the "Takumi head" optimize placement for different component heights?
A2: The 8-nozzle "Takumi head" automatically changes the laser sensor height based on the height of the component to be centered. For LX-8 and RS-1R, you can select from 6 levels (1, 3, 6, 12, 20, 25 mm), and for JM-100, you can select from 4 levels (16, 20, 25, 30 mm).
Q3: Can the DECAN Line equipment handle large-scale PCBs?
A3: Yes, standard equipment can be remodeled on-site to handle large-scale PCBs. It is responsive to a maximum PCB size of 1,200 x 460mm and accommodates uniquely-shaped components, including tray components.
Q4: What are the advantages of the active clinching unit?
A4: The new active clinch unit supports bend in, bend out, and N bend. This prevents components from lifting during the reflow process and makes component handling prior to reflow much easier.
Q5: Why is laser centering considered more reliable than standard vacuum detection?
A5: Since the laser is mounted directly on the head, it monitors the presence of the components the entire time from pick to placement. It also improves placement reliability by confirming the release of the component after placement, which is difficult to achieve with vacuum detection alone.