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High-Precision 3D Online SPI HMS-5 HMS-5-D - Quality Solder Paste Inspection by China Suppliers and Factory
Production Overview
It is used to detect and monitor the quality of solder paste printing. With the increasing precision of electronic products, chip components are becoming smaller and smaller, and the requirements for solder paste printing quality are gradually increasing. It can effectively guarantee the printing quality, improve the printing quality, reduce the defect rate of the product, save labor, and improve the production efficiency.
Key Features & Capabilities
High Speed & Maximum Throughput
The all-digital high-speed CCD camera cooperates with the industrial telecentric lens, high resolution, ultra wide depth of field, ultra low distortion and unique parallel light design, etc. It can clearly image the circuit board and the tall components without strabismus.
Plate Bending Compensation
Real-time measurement and compensation of board bending (refer to ideal board), can reach less than 2mm; provide clear PCB images and measurement data online in real time.
3D Raster Projection Head
Realize shadowless 3D detection without worrying about inaccurate measurement caused by shadows; five-step phase shift algorithm based on defocused sine grating stripes, height detection accuracy up to 1μm.
Easy Operation Interface
Support Gerber, CAD import, support offline programming and manual programming, easy to operate, can switch between Chinese and English system; Through more intuitive software, display 2D/3D true color images to help users read bad; choose 2 commonly used Mark points.
High Precision Platform
With AC servo motor system, coupled with precision ball screws and linear guide pairs, ensures high-speed and accurate detection capabilities, fast and stable movement, and positioning accuracy of less than 10μm.
Supports Offline SPC
Display histogram/control chart and true-color three-dimensional stereoscopic image, and export reports and pictures at any time period to trace the root cause of badness from the detection results.
Frequently Asked Questions
How does the system achieve high-speed and clear imaging?
It combines an all-digital high-speed CCD camera with an industrial telecentric lens. This setup offers high resolution, an ultra-wide depth of field, ultra-low distortion, and a unique parallel light design, allowing clear imaging of circuit boards and tall components without strabismus.
What is the capacity of the plate bending compensation solution?
The system provides real-time measurement and compensation of board bending (referring to an ideal board) up to less than 2mm, delivering clear PCB images and measurement data online in real time.
How accurate is the 3D raster projection head?
The 3D raster projection head utilizes a five-step phase shift algorithm based on defocused sine grating stripes. It delivers shadowless 3D detection and achieves a height detection accuracy of up to 1μm.
What programming methods and inputs does the software support?
The system supports Gerber and CAD import, offline programming, and manual programming. The software displays 2D/3D true color images to help identify defects and allows users to choose 2 commonly used Mark points.
What is the positioning accuracy of the mechanical platform?
Driven by an AC servo motor system, precision ball screws, and linear guide pairs, the mechanical platform ensures fast, stable movement with a positioning accuracy of less than 10μm.
How does Offline SPC assist in quality control?
Offline SPC displays histograms, control charts, and true-color 3D stereoscopic images. It allows users to export reports and pictures from any time period to easily trace the root cause of defects.