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JUKI JM-100 SMT Insertion Machine: Fast, Reliable Component Insertion from China Suppliers & Factory
Flexibility
Vision centering technology method can be selected based on component type, shape, size and material. Laser centering is used for high speed placement of smaller components. Vision is used when lead or ball inspection is needed or when the component is too large for the laser. Many nozzles are available for odd-shaped components providing unsurpassed component handling.
Automatic height change of recognition sensor
The 8-nozzle “Takumi head” automatically changes the laser sensor height according to the height of component that to be centered.
Various components from ultra-small component to large component can be optimally placed with best tact time.
LX-8, RS-1R: 6 levels (1, 3, 6, 12, 20, 25 mm) can be selected arbitrarily.
JM-100: 4 levels (16, 20, 25, 30 mm) can be selected arbitrarily.
Various components from ultra-small component to large component can be optimally placed with best tact time.
LX-8, RS-1R: 6 levels (1, 3, 6, 12, 20, 25 mm) can be selected arbitrarily.
JM-100: 4 levels (16, 20, 25, 30 mm) can be selected arbitrarily.
FLEXIBLE LINE SOLUTION
Provides optimal line solutions through versatility and productivity improvement
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DECAN Line
Optimal line configuration from chips to uniquely-shaped components according to options setup
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Equipment capable of responding to large-scale PCBs, which can be remodeled on site
Standard equipment can be remodeled on site to equipment capable of large-scale PCB handlingResponsive to a maximum 1,200 x 460mm PCB
- Responsive to uniquely-shaped components (including tray components)
Optimum line balance and highest throughput
Changing the RS-1 functionality does not require head replacement. The revolutionary design self-optimizes based on the production requirements. The RS-1R can reduce the workload on high speed. A line with two or more RS-1Rs can adjust to a wide variety of production requirements from high speed to high flexibility.
Active clinching
New active clinch unit supports bend in, bend out, and N bend to prevent components from lifting during reflow and make handling prior to reflow easier.
High-speed, on-the-fly centering
A high-resolution laser is mounted on the head to center components in all directions including angle. Centering is done on-the-fly, allowing high speed placement of components from small chips to SOPs.
Adaptable centering
1. Centering accommodates component variations
Laser centering measures the components on the side. It is not affected by variations of component color or width/length so, unlike vision centering, there is no need to edit component data for different component vendors.
2. Component check function improves placement reliability
Since the laser is mounted on the head, it can be used to monitor the presence of components the entire time from pick to placement. This is difficult to accomplish with vacuum detection only. The placement reliability is also improved because the release of the component is confirmed after placement.
Laser centering measures the components on the side. It is not affected by variations of component color or width/length so, unlike vision centering, there is no need to edit component data for different component vendors.
2. Component check function improves placement reliability
Since the laser is mounted on the head, it can be used to monitor the presence of components the entire time from pick to placement. This is difficult to accomplish with vacuum detection only. The placement reliability is also improved because the release of the component is confirmed after placement.
Frequently Asked Questions
What is the difference between Laser Centering and Vision Centering?
Laser centering is used for high-speed placement of smaller components and is not affected by variations in component color or dimensions. Vision centering is selected when lead or ball inspection is necessary or when components are too large for laser detection.
How does the sensor height adjustment work on the Takumi head?
The 8-nozzle "Takumi head" automatically alters the laser sensor height based on the component's physical height. Different levels can be selected (6 levels up to 25mm for LX-8 and RS-1R; 4 levels up to 30mm for JM-100) to ensure optimal tact time and placement.
Can standard DECAN Line equipment handle large-scale PCBs?
Yes, standard equipment can be remodeled directly on site to handle large-scale PCBs, accommodating board sizes up to a maximum of 1,200 x 460mm.
Does the RS-1 require head replacement to change functionality?
No, changing the RS-1 functionality does not require head replacement. The self-optimizing design dynamically adjusts based on production requirements to balance speed and flexibility.
How does active clinching help during the reflow process?
The active clinch unit supports bend in, bend out, and N bend. This prevents components from lifting during the reflow process and simplifies handling before the reflow stage.
Why is the component check function more reliable than vacuum detection alone?
Because the laser is mounted directly on the head, it monitors the component continuously from pick to placement. This confirms both the presence during transport and the successful release after placement, which vacuum-only systems cannot guarantee.